USB, which is the most popular standard for connecting peripherals to PCs is now also going inside the box.
A brand new specification, still under development, will, by the end of the year, allow USB 3.0 to be used a a standardized way of connecting chips inside a smartphone or computer.
The specification, which is under development by the USB Promoter’s Group carries the name SuperSpeed Inter-Chip (SSIC) specification and is combination of the MIPI M-PHY(SM) physical layer with the SuperSpeed USB protocol and software layers.
The M-PHY interface is a high speed serial interface targeting up to 2.9 Gbps per lane with up-scalability to 5.8 Gbps per lane as well as a low pin count and exceptional power efficiency. SuperSpeed USB has a 5 Gbps signaling rate offering a 10x performance increase over High-Speed USB with enhanced protocol and power management while retaining compatibility with the existing USB device and software model.S|A
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