TSV shrinks memory footprint
Elpida first to sample DDR3 TSV modules
Jul 5, 2011 in Microprocessors
Japanese memory manufacturer Elpida Memory, Inc. (TYO: 6665) has just started sampling some very advanced memory modules.
These modules use TSV – short for Through Silicon Via – to stack individual chips on top of each other thereby reducing the footprint required for the module.
Traditional modules are manufactured using the well known SO-DIMM layout from notebooks, but in many cases manufacturers of consumer electronics would prefer to solder the memory module directly onto the motherboard.
As can be seen on the illustration provided by Elpida, the new memory modules have a capacity of 1GB and 2 of these can replace a single SO–DIMM of 2GB.
Diagram courtesy of Elpida
TSV is a technology where you have conductive copper channels vertically through the entire chip. When you stack multiple chips on top of each other, these channels will make contact with each other allowing current to flow from chip to chip.
This technology can be contrasted to the traditional method of using wires along the edge of the chip. TSV reduces footprint to a minimum, but at the same time requires very precise manufacturing.S|A
Full press release can be found here.
Look like ARM just found the memory package it needed to compete with x86 notebook…
Why does this memory packaging give an ARM based design an advantage that won’t also apply to x86 designs that use the same memory?
Heat can be reduced by shortening the traces to the memory and reducing voltage. The large fan out of a DIMM can be 3-4 times that of a locally attached BGA.
How about the heat? Considering modules are stacked?
DDRs for portable equipment are optimized for low power consumption and thus low power dissipation. Unless you’re going to overclock such chip, the generated heat won’t be a big problem. The PCB itself acts as a good heatsink, especially with fine-pitch BGAs. If the TSVs are vertically aligned with the ball pads, the heat transfer would be significantly better than with bond wires
Thanks!
A well informed and nuanced answer with no trolling? What’s more its apreciated??? Wtf this can’t be the internets…