UMC develops 0.11 micron aluminum process

Only foundry in the world to go beyond 0.13 micron…

UMC logo 63x32 UMC develops 0.11 micron aluminum process

Many companies still prefer to use 8” wafers for products that are not exactly leading edge, but need cheap manufacturing.  If they wanted to go beyond 0.13 micron they have so far had to go the route of traditional silicon based technology, but now the Taiwanese foundry UMC (NYSE:UMC) is offering a process based on aluminum as well.

More precisely UMC will offer a blend of technology including logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS to address customers’ integration, performance and cost requirements.

“There are many applications still enjoying a comfort zone within 8-inch manufacturing facilities due to the attractive cost vs. performance benefits,” Steve Wang , vice president of Asian sales and corporate marketing at UMC, in a statement. “For applications such as timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS Image sensors, etc., A+ is the perfect technology sweet spot.”

The 0.11 micron specialty platform incorporates state-of-the-art solutions to help designers find an optimal balance between cost, performance, and functionality. A+ combines the most leading-edge 8″ production technology with aggressive Al-BEOL design rules. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, with flexible 8-inch manufacturing capacity to support customer production requirements, the company said.S|A

p5rn7vb
The following two tabs change content below.