The answer isn’t that easy, especially since Intel showed the wafer from a distance, and then pulled it away as soon as the post keynote picture melee began. Luckily, it was after SemiAccurate managed to grab 2.5 pictures of the wafer. The last .5 is partially obscured by the hand yanking it away, and quite blurry. The full wafer looks like this.
The wafer in question
Non-instrumented measurements of the die size, the industry insider term for counting the dies, show that the layout is about 9×13 chips on the wafer. Equally advanced math says that the dies are about 33mm x 21mm or a hair under 700mm^2 for the entire thing. Please recall that this chip is a technology demo and is not optimized, the next generation will shrink a lot. On a similar 32nm process the single core Penwell is about 82mm^2, but that is a full SoC including a GPU.
Diagram of the not small Rosepoint
Even if you doubled Penwell, GPU and all, you would only be a bit more than 25% of Rosepoint’s die size. Rosepoint does not have a GPU either, and that takes up a large chunk of Penwell’s die area. Short story, the radio is not small, really really not small. Then again, no one else can do it at all, so by that measure, it is infinitely smaller than the competition. Better yet for Intel, it will shrink in half on the next generation, the competition won’t.S|A
Latest posts by Charlie Demerjian (see all)
- Intel finally kicks Microsoft to the curb shattering Wintel - Apr 16, 2014
- Broadcom’s latest 802.11ac announcement one ups the competition - Apr 16, 2014
- Is ARM’s monopoly dominance of cow stomach computing about to end? - Apr 15, 2014
- Quantenna announces 8×8 802.11ac Release 2 MU-MIMO chips - Apr 14, 2014
- Samsung breaks Intel Xeon NDAs in a press release - Apr 10, 2014