IBM adds .5 dimensions to chip stacks in one year
Common Platform 2013: 2.5D at the 2012 show, 3D in 2013, next year…
IBM had two packaging goodies on display at Common Platform including one that SemiAccurate has shown you before.
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IBM had two packaging goodies on display at Common Platform including one that SemiAccurate has shown you before.
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In the last part, we took a look at Intel’s NUC new mini-PC form factor, what it got you for the money, and how it stacked up to the competition.
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Through a blog post on its website, AMD has revealed that it’s moving its yearly Developer Summit from Bellevue, Washington to San Jose, California.
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At the Common Platform conference today, IBM showed off a bunch of goodies including two new types of wafers.
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When Intel first put out the NUC FFRD, SemiAccurate thought that it was not only a bad idea, it illustrated all that was wrong with modern Intel.
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Adata had the usual display of bigger, faster, and cheaper memory products on display at CES along with a new product category entirely.
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Back in November Intel published a surprisingly good documentary on the development of its Xeon Phi chip.
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There were so few interesting things at CES the show was almost painful, but CPU maker Ingenic had two of them at their booth.
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