AMD just vaulted back into the advanced packaging lead last night with their 3D V-Cache technology.
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SemiAccurate’s moles are singing a song all the way from Genoa about a new feature
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IBM had two packaging goodies on display at Common Platform including one that SemiAccurate has shown you before.
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There is a lot of talk about the benefits of chip stacking, but only one company is doing it in volume, Xilinx.
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The three most pressing problems of modern silicon design, power, I/O pins, and yields can all be addressed by chip stacking.
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Hot Chips 24 had their usual tutorials on the first day, and this year the second topic, chip stacking, was of particular interest to SemiAccurate.
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