AMD just vaulted back into the advanced packaging lead last night with their 3D V-Cache technology.
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At their annual Social Media Summit this year, Qualcomm’s biggest bang wasn’t a chip, it was a module.
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Xilinx recently released the world’s largest FPGA, the 16nm VU19P with more than 9M logic cells. This third generation ‘worlds largest’ is based on their familiar SSI tech which is what SemiAccurate is most interested in. When you think about …
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One of the most interesting technologies shown in 2018 was Intel’s Foveros chip stacking.
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A few days ago Fudzilla outed some info about the new AMD Zen based Naples chip.
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If you remember SemiAccurate’s exclusive news about Nvidia’s P100 GPU problems, there is an update.
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Computex showed off an interesting bit of HBM memory, cost savings to the rest of the system.
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AMD was showing off an ‘unknown’ graphics chip at Computex, just don’t call it Fiji.
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AMD is finally talking about HBM today, and SemiAccurate thinks there is a lot of good in the details.
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AMD is talking quite a bit about it’s future prospects, but aside from a few details it is only in vague terms.
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Global Foundries has taken a huge step toward mass-market TSVs with their first 20nm wafer with that technology.
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IBM had two packaging goodies on display at Common Platform including one that SemiAccurate has shown you before.
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There is a lot of talk about the benefits of chip stacking, but only one company is doing it in volume, Xilinx.
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Remember when we said that Haswell’s shader count was only the beginning of the performance story? The real reason behind the performance isn’t shader count, it is memory. When we wrote that Haswell was a graphics monster a few months …
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Every once in a while, a company will do something really unexpected, like IBM’s laying down the law in packaging last week.
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