Intel launches the Lakefield SoC
No questions before is a subtle hint
Intel is finally launching Lakefield today but doing so in a curious manner.
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Intel is finally launching Lakefield today but doing so in a curious manner.
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One of the most interesting technologies shown in 2018 was Intel’s Foveros chip stacking.
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In a briefing at ISSCC Sony announced the creation of the first three-layer stacked image sensor.
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Global Foundries has taken a huge step toward mass-market TSVs with their first 20nm wafer with that technology.
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Want to roll your own processor, but can’t afford the fabbing of an ASIC?
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