At Xilinx XDF 2018, Nallatech/Bittware was showing off some liquid cooled FPGA boards for those who need really high performance compute.
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Intel’s trend of increasingly less credible press releases accelerated yesterday when they “Unveiled” an FPGA with HBM2 memory
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ARM is announcing their lead partner for 7nm Artisan IP and it is none other than Xilinx.
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ARM, Qualcomm, AMD, Xilinx, Huawei, IBM, Mellanox, and Xilinx all agree on CCIX interconnects.
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Everspin and Northwest Logic have teamed up on and FPGA based DDR3 controller supporting ST-MRAM.
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At Hot Chips this year, Xilinx gave a good talk on the problems with electrical and optical backplanes, and what the options are to deal with some thorny impending problems.
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There is a lot of talk about the benefits of chip stacking, but only one company is doing it in volume, Xilinx.
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The three most pressing problems of modern silicon design, power, I/O pins, and yields can all be addressed by chip stacking.
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Hot Chips 24 had their usual tutorials on the first day, and this year the second topic, chip stacking, was of particular interest to SemiAccurate.
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